The candidate will be part of a dynamic design team that is responsible for driving package design integration, verification and characterization in advanced FPGA systems, incorporating silicon/TSV, package stack-up/routing/PDN, discrete decoupling capacitors and system board interfaces. You will utilize the knowledge of physical design and skillset in programmable language to drive the package design automation planning and execution in every aspect of package design from layout, DFM, pin out to electrical verifications. While working as a member of a cross functional team, the candidate must communicate to silicon design, package, board design and CAD teams to accomplish joint-development goals in die-package-PCB co-design for product quality and efficiency enhancement.
Years of Experience
MSEE and 5~10 years of direct experience; BSEE and 7~12 years of direct experience