Job Description
Description
At Xilinx, we are leading the industry transformation to build an adaptable, intelligent world. ARE YOU bold, collaborative, and creative? At Xilinx, we hire and develop leaders and innovators who want to revolutionize the world of technology. We believe that by embracing diverse ideas, pushing boundaries, and working together as ONEXILINX, anything is possible.
Our culture of innovation began with the invention of the Field Programmable Gate Array (FPGA), and with the 2018 introduction of our Adaptive Compute Acceleration Platform (ACAP), has made a quantum leap in capability, solidifying our role as the adaptable platform supplier of choice. From the start, we have always believed in providing inventors with products and platforms that are infinitely adaptable. From self-driving cars, to world-record genome processing, to AI and big data, to the world's first 5G networks, we empower the world's builders and visionaries whose ideas solve every day problems and enhance people's lives.
If you are PASSIONATE, ADAPTABLE, and INNOVATIVE, Xilinx is the right place for you! At Xilinx we care deeply about creating meaningful development experiences while building a strong sense of belonging and connection. We foster an environment of empowered learning, wellness, community engagement, and recognition, so you can focus on work that matters - world class technology that improves the way we live and work. We are ONEXILINX.
InFO Package (Wafer Level Chip Scale Package) Experience:
- To support InFO package hardware design and process
development
- Design
InFO package board at wafer sort and Final Test platform
Board Designer Requirements:
- Perform board electrical and mechanical simulation and
check across specification and requirements
- Strong knowledge in power and signal integrity.
- Generate & verify PCB layout rules; Work with vendors
to evaluate design trade-offs & optimize
performance/risk/cost/manufacturability.
- Guide and support all aspects of PCB layout, fabrication
and assembly processes.
- Complex simulations and modeling to derive most robust,
high performance solution for mechanical and electrical testing
- Drives NPI product mechanical test developments to meet
time-to-market demands centered on POR and production rollout milestones
- Leverages understanding of NPI requirements, new product
packages and manufacturing processes to enable fast ramp-up to meet yield
and cost roadmaps
- Provides
innovative hardware solutions to complex mechanical NPI challenges
- Good in analyzing how
all the elements of a design solution fit together.
- Good evaluation on
internal request against requirements.
- Exercises solid
analytical problem solving in troubleshooting hardware
Soft
Skill Requirements:
- Communicates regularly with cross functional
leaders on fast changing product profiles impacting production
manufacturability, and ensure
responsive change management to address new technologies
- Accurately documents and
effectively communicates the rational for a design to design
implementation stakeholders (e.g., peer reviews, Technical Solution
Groups, management)
- Present design decisions
in a constructive and professional way before peers and direct management.
- Questions
and provides insights on statistical results as the basis for designing
experiments to reach valid and reliable conclusions
Education Requirements
Minimum a degree holder in engineering field. Master degree will be an advantage.
Years of Experience
Minimum of 5 years in related field
Experience in InFO Package (Wafer Level Chip Scale Package) process and hardware development
Experience in board design or equipment design
