Xilinx develops highly flexible and adaptive processing platforms that enable rapid innovation across a variety of technologies - from the endpoint to the edge to the cloud. Xilinx is the inventor of the FPGA, hardware programmable SoCs and the ACAP (Adaptive Compute Acceleration Platform), designed to deliver the most dynamic processor technology in the industry and enable the adaptable, intelligent and connected world of the future in a multitude of markets including Data Center (Compute, Storage and Networking); Wireless/5G and Wired Communications; Automotive/ADAS; Emulation & Prototyping; Aerospace & Defense; Industrial Scientific & Medical, and others. Xilinx's core strengths simultaneously address major industry trends including the explosion of data, heterogeneous computing after Moore's Law, and the dawn of artificial intelligence (AI).
Our global team is growing and we are looking for bold, collaborative and creative people to help us lead the industry transformation to build an adaptable intelligent world. We believe that by embracing diverse ideas, striving for excellence in all that we do, and working together as a unified team, we can accomplish anything. Come do your best work and live your best life as part of the ONEXILINX team!
Being part of the Xilinx Packaging Development department, you will lead an engineering team to assess and validate electrical performance for the new cutting-edge packaging technology and industry-leading ACAP products in the die/pkg/board co-design environment. You will also manage the new product/package introduction by teaming up with internally the package architecture and design team and externally the silicon stakeholders, signal/power integrity, program management, and the operating organization. This position requires both technical insight and skillful communication to develop the cross-functional synergy timely to resolve issues during the execution of new product development.
-Possesses an understanding of high-speed serdes, memory interface, supply voltage noise, and packaging technologies/trend to drive package design validation throughout all phases of product cycle
-Understand in-depth package development flow and work fluently with NPI program management and manufacturing/process team to synthesize a cohesive package introduction plan
-Interface and negotiate effectively across engineering teams to balance performance adequacy and schedule commitment
-Drive package design review, manage modeling/simulation deliverables, prepare and present the final design review (FDR) to all product stakeholders
-Collaborate with silicon IP, silicon evaluation and package technology teams to establish the development plan and timeline for the R&D project, test vehicle, and prototype packages
BS with 12+ years of experience or MS with 8+ years of experience or PhD with 5+ years of experience in Electrical Engineering or Computer Science or related equivalent
Years of Experience
Industry experience in IC package technology and product development in the semiconductor industry with proven records.
5+ years project/program execution and engineering team management experience in the IC package development field
Demonstrate management experience in complex product development under challenging technical and schedule conditions