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Assembly & Package Staff Engineer

156464
San Jose, CA, United States
Jun 6, 2019

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Job Description

Description

Xilinx develops highly flexible and adaptive processing platforms that enable rapid innovation across a variety of technologies - from the endpoint to the edge to the cloud. Xilinx is the inventor of the FPGA, hardware programmable SoCs and the ACAP (Adaptive Compute Acceleration Platform), designed to deliver the most dynamic processor technology in the industry and enable the adaptable, intelligent and connected world of the future in a multitude of markets including Data Center (Compute, Storage and Networking); Wireless/5G and Wired Communications; Automotive/ADAS; Emulation & Prototyping; Aerospace & Defense; Industrial Scientific & Medical, and others. Xilinx's core strengths simultaneously address major industry trends including the explosion of data, heterogeneous computing after Moore's Law, and the dawn of artificial intelligence (AI).

Our global team is growing and we are looking for bold, collaborative and creative people to help us lead the industry transformation to build an adaptable intelligent world. We believe that by embracing diverse ideas, striving for excellence in all that we do, and working together as a unified team, we can accomplish anything. Come do your best work and live your best life as part of the ONEXILINX team!

 

Xilinx Assembly Engineering is seeking a highly motivated Assembly and Packaging Staff Engineer to work on advanced IC packaging solutions. The position primarily involves developing packaging solutions and enhancing product quality and reliability for various Advanced Flip Chip, 3D/SIP/TSV packages. The candidate will interface with overseas Foundry, Assembly, and Substrate suppliers working with stakeholders from Silicon, Package Development, Design and Manufacturing groups to bring reliable, cost effective and quality solutions for advanced Silicon node packages.  The candidate will also drive efforts to enhance the 2nd level reliability for the end user conditions.

Responsibilities:

  • Drive IC packaging initiatives from product qualification to high volume ramp for next generation FPGA devices
  • Collaborate with foundry and OSAT suppliers to define process flow’s and process control to enable high volume manufacturing
  • Drive manufacturing process quality through FMEA and
  • Lead comprehensive reliability evaluations to determine the quality and reliability margin for the product
  •  Research and develop solutions to enhance FPGA product reliability for end users
  • Innovate methods to add more value to the product through optimizing product cost, yield and performance

 

 

 

Qualifications:

 

  • MS with 10+ years of industrial experience or PhD degree with 6+ years of industrial experience in materials, mechanical or electrical engineering
  • Hand on experience in semiconductor packaging/foundry process development and high-volume ramping
  • Hands on experience on 2.5D/3D technologies highly desired
  • Good understanding of bumping, TSV, RIE, CVD, CMP processes is highly desired
  • Sound knowledge of packaging materials, structures, process development and their interactions
  • Good understating of JEDEC methodology for component level and board level reliability qualification requirements
  • Familiarity with packaging, latest reliability and fault isolation methods/principle
  • Familiarity with package mechanical and electrical modeling for reliability and design of large outline SIP substrate will be a plus
  • Excellent communication skills
  • Team player

 

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