Xilinx develops highly flexible and adaptive processing platforms that enable rapid innovation across a variety of technologies - from the endpoint to the edge to the cloud. Xilinx is the inventor of the FPGA, hardware programmable SoCs and the ACAP (Adaptive Compute Acceleration Platform), designed to deliver the most dynamic processor technology in the industry and enable the adaptable, intelligent and connected world of the future in a multitude of markets including Data Center (Compute, Storage and Networking); Wireless/5G and Wired Communications; Automotive/ADAS; Emulation & Prototyping; Aerospace & Defense; Industrial Scientific & Medical, and others. Xilinx's core strengths simultaneously address major industry trends including the explosion of data, heterogeneous computing after Moore's Law, and the dawn of artificial intelligence (AI).
Our global team is growing and we are looking for bold, collaborative and creative people to help us lead the industry transformation to build an adaptable intelligent world. We believe that by embracing diverse ideas, striving for excellence in all that we do, and working together as a unified team, we can accomplish anything. Come do your best work and live your best life as part of the ONEXILINX team!
Xilinx Assembly Engineering is seeking a highly motivated Assembly and Packaging Staff Engineer to work on advanced IC packaging solutions. The position primarily involves developing packaging solutions and enhancing product quality and reliability for various Advanced Flip Chip, 3D/SIP/TSV packages. The candidate will interface with overseas Foundry, Assembly, and Substrate suppliers working with stakeholders from Silicon, Package Development, Design and Manufacturing groups to bring reliable, cost effective and quality solutions for advanced Silicon node packages. The candidate will also drive efforts to enhance the 2nd level reliability for the end user conditions.