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Senior Assembly Engineer

Taichung, Taiwan, Taiwan
Jun 26, 2019


Job Description



At Xilinx, we are leading the industry transformation to build an adaptable, intelligent world. ARE YOU bold, collaborative, and creative? At Xilinx, we hire and develop leaders and innovators who want to revolutionize the world of technology.  We believe that by embracing diverse ideas, pushing boundaries, and working together as ONEXILINX, anything is possible.

Our culture of innovation began with the invention of the Field Programmable Gate Array (FPGA), and with the 2018 introduction of our Adaptive Compute Acceleration Platform (ACAP), has made a quantum leap in capability, solidifying our role as the adaptable platform supplier of choice.  From the start, we have always believed in providing inventors with products and platforms that are infinitely adaptable. From self-driving cars, to world-record genome processing, to AI and big data, to the world’s first 5G networks, we empower the world’s builders and visionaries whose ideas solve every day problems and enhance people’s lives.

If you are PASSIONATE, ADAPTABLE, and INNOVATIVE, Xilinx is the right place for you!  At Xilinx we care deeply about creating meaningful development experiences while building a strong sense of belonging and connection. We foster an environment of empowered learning, wellness, community engagement, and recognition, so you can focus on work that matters – world class technology that improves the way we live and work.  We are ONEXILINX.

We are looking for an experienced Senior Engineer with a focus on assembly & packaging manufacturing technology.  In this position, you will be responsible for working with the BU and assembly partners to define, assess, qualification and ramp to production and sustaining production with best in class yield, cost, and package reliability.

  •  Leads establishment, review and audit of manufacturing specification, control plan and FMEA for all assembly & substrate and suppliers

  •  Lead NPI to evaluate and validate new design rules, manufacturing process and new material does not impact schedule on time to market, cost, quality and reliability tests

  •  Lead NPI qualification with the goal to achieve success in first time passing Xilinx defined reliability test.

  •  Lead collaboration with suppliers to meet Xilinx's goals (cost, yield, quality and reliability) and continuous improvement activities

  •  Lead investigations, risk assessments on quality activities including PCN, lot on holds, issues including MRB, customer complaints, RMA

  •  Publish yield, quality metrics and indices report on weekly, monthly and quarterly.

  •  Lead all evaluation data collection including FAI and use statistical analysis to present data and decision made.


Education Requirements

Bachelor or Masters of Science Materials Science & Engineering, Mechanical Engineering, Chemical engineering, Physics and Electrical Engineering.


Qualification Requirements
  • 6-10 yrs of Industrial Experience

  • Excellent knowledge in wire bond & flip chip interconnect technology, lead frame, laminate and ceramic substrate technology.

  • Experience working with assembly sub-contractors.

  • Excellent knowledge of assembly materials and new material development, assembly technology, supplier capability trends, design rules

  • Excellent knowledge in new product introduction and implementation of continuous improvements on existing products involving complex electronic systems.

  • Strong fundamentals in the fields of Applied Physics, materials selection methodologies, Design of Experiments, statistical analysis, SPC methodologies and data tools.

  • Hands-on knowledge of package reliability requirements, failure analysis techniques

  • Excellent knowledge of JEDEC, EIA, IPC, and Military Standards (Mil-Std-883, Mil-PRF-38535)

  • Strong leadership skills, program management skills, good problem solving, effective communication, writing and presenting technical reports.

  • Fast learner, self-motivated, team player and accomplishment-driven

  • Works well under pressure

  • Well-organized and detail-oriented with "Do it right the first time" attitude