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We are looking for an experienced Senior Engineer with a focus on assembly & packaging manufacturing technology. In this position, you will be responsible for working with the BU and assembly partners to define, assess, qualification and ramp to production and sustaining production with best in class yield, cost, and package reliability.
Leads establishment, review and audit of manufacturing specification, control plan and FMEA for all assembly & substrate and suppliers
Lead NPI to evaluate and validate new design rules, manufacturing process and new material does not impact schedule on time to market, cost, quality and reliability tests
Lead NPI qualification with the goal to achieve success in first time passing Xilinx defined reliability test.
Lead collaboration with suppliers to meet Xilinx's goals (cost, yield, quality and reliability) and continuous improvement activities
Lead investigations, risk assessments on quality activities including PCN, lot on holds, issues including MRB, customer complaints, RMA
Publish yield, quality metrics and indices report on weekly, monthly and quarterly.
Lead all evaluation data collection including FAI and use statistical analysis to present data and decision made.
Bachelor or Masters of Science Materials Science & Engineering, Mechanical Engineering, Chemical engineering, Physics and Electrical Engineering.
6-10 yrs of Industrial Experience
Excellent knowledge in wire bond & flip chip interconnect technology, lead frame, laminate and ceramic substrate technology.
Experience working with assembly sub-contractors.
Excellent knowledge of assembly materials and new material development, assembly technology, supplier capability trends, design rules
Excellent knowledge in new product introduction and implementation of continuous improvements on existing products involving complex electronic systems.
Strong fundamentals in the fields of Applied Physics, materials selection methodologies, Design of Experiments, statistical analysis, SPC methodologies and data tools.
Hands-on knowledge of package reliability requirements, failure analysis techniques
Excellent knowledge of JEDEC, EIA, IPC, and Military Standards (Mil-Std-883, Mil-PRF-38535)
Strong leadership skills, program management skills, good problem solving, effective communication, writing and presenting technical reports.
Fast learner, self-motivated, team player and accomplishment-driven
Works well under pressure
Well-organized and detail-oriented with "Do it right the first time" attitude