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Sr Packaging Engineering

Hsin Chu, Taiwan, Taiwan
Sep 19, 2018


Job Description


Xilinx develops highly flexible and adaptive processing platforms that enable rapid innovation across a variety of technologies - from the endpoint to the edge to the cloud. Xilinx is the inventor of the FPGA, hardware programmable SoCs and the ACAP (Adaptive Compute Acceleration Platform), designed to deliver the most dynamic processor technology in the industry and enable the adaptable, intelligent and connected world of the future in a multitude of markets including Data Center (Compute, Storage and Networking); Wireless/5G and Wired Communications; Automotive/ADAS; Emulation & Prototyping; Aerospace & Defense; Industrial Scientific & Medical, and others. Xilinx's core strengths simultaneously address major industry trends including the explosion of data, heterogeneous computing after Moore's Law, and the dawn of artificial intelligence (AI).

Our global team is growing and we are looking for bold, collaborative and creative people to help us lead the industry transformation to build an adaptable intelligent world. We believe that by embracing diverse ideas, striving for excellence in all that we do, and working together as a unified team, we can accomplish anything. Come do your best work and live your best life as part of the ONEXILINX team!


Package Assembly Supplier Engineering


·    Direct experience working with assembly, substrate, and fab suppliers on HVM of monolithic and 3D flip chip packages.

·         Experience in assembly process development and statistical data analysis.

·         Understand how to assess package materials, processes, and die to package interactions (DPI).

·         Familiar with package behavior characterization using Digital Image Correlation/Shadow Moiré techniques and understanding of failure analysis techniques

·         Ability to clearly communicate packaging concepts and issues to management, assembly suppliers and customers.

·         Ability to work independently and take on projects with minimum supervision.

·         Position requires travel within Taiwan to various supplier locations.



Education Requirements

Years of Experience


  • BS with 2 years of experience or Master or PhD or in materials, mechanical or engineering equivalent
  • A minimum of 2 years of experience in flip chip assembly and related package engineering experience
  • Candidates with experience working in 3D flip chip package assembly are highly desirable