highly flexible and adaptive processing platforms that enable rapid innovation
across a variety of technologies - from the endpoint to the edge to the cloud.
Xilinx is the inventor of the FPGA, hardware programmable SoCs and the ACAP
(Adaptive Compute Acceleration Platform), designed to deliver the most dynamic
processor technology in the industry and enable the adaptable, intelligent and
connected world of the future in a multitude of markets including Data Center
(Compute, Storage and Networking); Wireless/5G and Wired Communications;
Automotive/ADAS; Emulation & Prototyping; Aerospace & Defense; Industrial
Scientific & Medical, and others. Xilinx's core strengths simultaneously
address major industry trends including the explosion of data, heterogeneous
computing after Moore's Law, and the dawn of artificial intelligence (AI).
Our global team is growing and we are looking for bold, collaborative and
creative people to help us lead the industry transformation to build an
adaptable intelligent world. We believe that by embracing diverse ideas,
striving for excellence in all that we do, and working together as a unified
team, we can accomplish anything. Come do your best work and live your best
life as part of the ONEXILINX team!
We are looking for a talented, self-driven and motivated mechanical engineer to be part of a technology development team in Xilinx. This team develops cutting-edge technologies used in our products and its team members have ample opportunities to grow their technical knowledge and complex problem-solving skills.
In this position, this engineer will work in the thermo-mechanical product development and the introduction of the solution to the production. The candidate will need to have strong experience in using Solidwork, Flotherm and Icepack, as well as, strong understanding of the mechanical design and heat transfer of electronics equipment and packaging. Also, the candidate will need to reveal a solid engineering practice in the following area:
Working with the EMS to collect the key engineering data;
Establishing the best engineering practice to assemble the thermo-mechanical solution during technology development and transfer to NPI group;
Driving thermo-mechanical Suppliers;
Defining, conducting and mentoring the thermal Qualification tests internally and externally;
Experience in using and analyzing Shadow Morrie’, DIC, SAM, FIB, X ray
BS with minimum of 5 years of experience or MS with 3 to 5 years of experience in telecom, data center and consumer electronics products.
Hands-on experience with using Solid work, Flotherm, Icepak
Strong knowledge of thermos-mechanical design is required.
Strong knowledge of manufacture and assembly process
Strong communication and team work skills
Experience in driving with thermo-mechanical suppliers and EMS